CCM03 connectors have been developed to interface with SIM/SAM cards as defined by GSM11-11 and ENV1375-1. The connectors are available with either hinged covers or fixed covers and have been designed to minimize the amount of space needed for PCB mounting.

Features

• Hinged Cover

• Available with 6 or 8 contacts, with or without PCB locating pegs.

• Available with insulated card presence switch.

• The cover springs open when unlocked while the card is in place.

• The molding is polarized so that the cover can only be closed if the card is correctly inserted.

• The cover can be replaced without removing the connector from the PCB.

• Inspection slots allow an electrical test to be made without opening the cover.

• The overall height of the connector is only 2,5 mm. The amount of space needed to mount the connector is just 29,65 mm x 17,2 mm.

Fixed Cover

• Available with 6 or 8 contacts.

• The overall height of the connector is 2,85 mm max. Only 25,5 mm x 17,2 mm of board space is required to mount the connector.

General

• With tape and reel packaging as standard, the connectors are designed to be automatically pick-and-placed.

• The high temperature thermoplastic moldings are suited for infrared and convection soldering processes.

• By using an inlay finish in the contact area the life of the precious metal is extended by over 10 times that of standard gold plating.

• Robustly formed printed circuit tails allow a co-planarity of ± 0,05 mm to be maintained.

1. Contacts Copper alloy

2. Plating Contact area : Gold alloy inlay or gold over nickel

3. Terminals : Tin lead (2μ min)

4. Moldings High temp. thermoplastic UL 94V-0 rated

5. Slide lock/metal cover Stainless steel

6. Number of Contacts 6 or 8

7. Mechanical life, hinged cover 10,000 cycles min

8. Mechanical life, fixed cover 50,000 cycles

9. Card insertion force Hinged cover: 1 N max Fixed cover: 3 N max

10. Card extraction force Hinged cover: 1 N max Fixed cover: 0.80 N min / 3 N max

11. Contact force 0.25 N min / 0.50 N max

12. Slide locking force 2 N min / 6 N max

13. Vibration Frequency 10 to 500 Hz. Acceleration 50m/s2 Duration 6 hours - amplitude 0,35 mm Max electrical discontinuity 1μs

14. Shock Peak value 500 m/s2 – Duration 11 ms 3 shocks in each direction of each axis Max electrical discontinuity 1 μs

15. Insulation resistance 1,000 MΩ min

16. Resistance 100 mΩ max

17. Current rating 10 μA min / 1 A max

18. Dielectric strength 750 Vrms min

19. Card detection switch Normally open

20. Contact resistance 100 mΩ max

21. Dielectric strength 250 Vrms min

22. Current rating 1 mA min / 10m A max

23. Maximum power 0.2 VA

24. Operating temperature -40°C to +85°C

25. Soldering temperature Temperature/time profile acc. to CECC00802 para. 6.1, Fig. 3 with peak temperature 250°C

26. Damp heat IEC 512 test number 11c (10 days)

27. Salt mist IEC 512 test number 11f (96 hours)